Xperi Licenses DBI Hybrid Bonding Tech to Chinese Chipmaker

Xperi announced an IP licensing agreement with Yangtze Memory Technologies for its DBI hybrid bonding technology, said Xperi Tuesday. Hybrid bonding 3D integration technology is increasingly being used in sensors, memory and logic semiconductors to enable enhanced functionality while reducing size and cost, Xperi said. In 3D NAND applications, DBI hybrid bonding technology enables the disaggregation of the memory array and logic circuitry allowing the optimal wafer process node to be used for each, it said.