Xperi's Invensas Licenses 3D Interconnect Tech to Israeli Chip Firm

Israel-based Tower Semiconductor licensed Invensas ZiBond and DBI 3D semiconductor interconnect technologies, said Tower and Invensas parent Xperi Wednesday. The license supports manufacturing of time of flight and advanced sensors for CE, machine vision, autonomous vehicles and smart devices. Tower will also explore the use of Invensas 3D integration technologies for memories and micro-electromechanical system devices. Xperi and TiVo completed their merger June 1 and will operate under Xperi (see personals section, June 9).