Xperi in IP Licensing Deal With SK Hynix for Hybrid Bonding Interconnect Tech

Xperi announced a patent and license agreement with SK hynix, for semiconductor intellectual property and a technology transfer of Invensas DBI Ultra 3D interconnect technology for memory chips. The DBI Ultra die-to-wafer hybrid bonding 3D interconnect technology platform enables eight-, 12- and 16-high chip stacks within packaging height and performance requirements for high-performance computing, Xperi said Friday.